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Modeling & Simulation
We frequently employ Computer Aided Engineering (CAE) software in analyzing your PCB design’s susceptibility to failure in use, thermal dissipation, capability in operation, and even determination of root cause modes of possible failure in design. All are possible in our Interconnect Technology Center (ITC) Simulation Laboratory, where our scientists not only practice the use of leading-edge FEA and stochastic modelling tools, but also maintain physical characterization test equipment to validate performance and loss modes in relevant test structures and actual product.

We believe these simulation and validation engineering capabilities are another example that distinguishes our customer orientation from other fabricators. Since your products are unique, we recommend a preliminary engineering review with the ITC to design the simulation and testing protocols that will characterize your future product performance capabilities.