Increasing system performance and higher component edge rates often increases total power dissipation issues at the shelf level. To improve waste heat transfer to case and maintain a lower component operating temperature requires fabrication options for heat flow management. Multek offers a complete range of embedded metal structures integrated into the mass production process flow.
Our Engineering Solutions teams can recommend the best combination of factor-ready options for your product specifications. By applying heat flow and power management simulation modeling, and real time thermal imaging tools, we can provide new insights into the best embedding locations and alloy choices.
For medium to high temperature applications, Multek offers a range of single-sided flexible circuits attached to aluminum stiffeners. A wide variety of configurations are available depending upon your design requirements:
0.5oz to 2oz
Electrodeposited (ED) or Rolled Annealed (RA)
Polyimide 25µm (1 mil), 50µm (2 mil) or 125µm (5 mil)
PEN 50µm (2 mil)
PET 50µm (2 mil), 75µm (3 mil) or 125µm (5 mil)
Flame Retardant (FR) adhesives available
25µm (1 mil) or 50µm (2 mil)
Pressure Sensitive Adhesive (PSA) or Thermal Set Acrylic
0.8 mm to 1.6 mm
UV or thermally-cured soldermask
Liquid Photoimageable Ink