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Multek > Technology > Thermal Management
Thermal Management
Increased component edge speeds, and greater surface mounting densities can result in temperature increases that can sharply reduce individual semiconductor component lifetimes. To help minimize these issues, Multek provides a broad suite of innovative, thermal management solutions.

Through the use of embedded heat transfer capabilities with applications in rigid, flexible and rigid-flexible architectures, Multek is able to offer processes for solid-plated microvia arrays, solid metal embedded structures (“Coins”) using press-fit, plated cavity, and surface-attached heat transfer media.

For performance validation, we offer advanced thermal imaging and stochastic finite element model simulations for optimizing heat transfer from critical circuit mounted components.

Thermally Enhanced PCB

FPC with Aluminum Stiffener

Click here to see examples of our enhanced passive heat transfer PCB options.