Printed Circuit Board (PCB) technology evolves at a faster pace every day. Multiprocessor scaling and differential impedance requirements, coupled with the need for faster high-performance materials, is driving circuit density and layer counts upward.
Production Capabilities • Layers (2-40)
• Lines and Spaces (Volume 3/3 Prototype 2/2)
• Controlled Impedance (+/- 10% Standard)
• Blind and Buried Vias
• Buried Capacitance
• µvias
• High Performance and Emerging Materials
• Sequential Lamination
• Ultra Fine Pitch (0.8, 0.5, 0.4, 0.3 mm) |
 |
Advanced Technologies