Novaclad™ HDI (High Density Interconnect) offers high-density single and double-layer flexible interconnects that thrive under the extreme conditions in today's high-end electronic applications. Novaclad™ is based on Novaclad® adhesiveless laminates which utilize thin copper, laser drilled vias, fine pitch imaging, and multiple surface finishes.
Novaclad™ HDI flexible circuits are processed using Multek’s state-of-the-art roll-to-roll processing system. Novaclad™ HDI is available with a variety of photo-imaged solder masks or laminated film dielectrics.
Available Surface Finishes Include:
- Electroplated Hard Gold
- Soft Wire-bondable Gold
- Electroplated Solder or Tin
- Immersion Silver
- Bare Copper Treatments
Applications that are well served using this unique interconnect solution: demanding automotive applications, cellular phones, telecommunications, computer system and peripheral interconnects.
Click here to learn more about Thermal Management.