In response to new system performance demands in the wireless infrastructure market, Multek introduced our first inlay Printed Circuit Board (PCB) technology in 2012. In prior product applications, a full panel FR4 material is applied in hybrid stackup construction with full panel cores of high frequency yet low loss material, resulting in a costly manufacturing process.
To reduce total panel cost and increase yields, Multek introduced selective semi-finished inlay circuitry using high-frequency laminate, into overall FR4 laminate panels using 3D structuring. With only a small part of final PCB design area specified for high frequency signal transfer, our inlay innovations reduce the amount of high-frequency laminate and allow integration of our thermal solutions into your final optimized design. A full design guide is available upon request.