Data Elements

  • Inner and outer layer data (all copper layers)
  • Legend layers
  • Aperture list if apertures are not embedded in the Gerber data
  • Solder mask layers
  • Drill file with tool codes and X-Y coordinates of all holes in either ASCII or EIA format
  • IPC 356 netlist or mentor graphics neutral file
  • A readme file that contains an engineering contact and any special instructions

Drawing File

  • Drawing in Gerber, DXF format, HPGL, PDF or hardcopy
  • Board outline dimensions including cutouts, chamfers, radii, bevels, scores, etc.
  • Dimension from a reference hole in the board to a corner or to two sides of the board outline
  • A hole chart with the hole symbols on the drawing and the finished hole sizes
  • Material requirements
  • Finished board thickness and tolerance
  • Layer stack-up order
  • Controlled impedance requirements (if applicable)
  • Dimensioned array drawing if the design is to be shipped as a multiple -up array
  • Surface finish
  • Coin related information
  • Carbon ink requirement
  • All kinds of tolerance requirement
  • X- out allowed
  • Gold requirement if application
  • Notes defining any other requirements or specifications pertinent to the design

Readme File

  • Engineering contact (email and phone)
  • Sales contact (email and phone)
  • Turn-time in days (if submitted for quotation)
  • Quantity desired (if submitted for quotation)


Stephen Sims
Stephen Sims
Americans Director
Kenth Svärd
Kenth Svärd
EMEA Director
Stan Chow
Stanley Chow
Asia Director