Standard Rigid-Flex provides a cost-effective alternative to rigid Printed Circuit Board (PCB) modules and Flexible Printed Circuit (FPC) interposers/connector systems. Multek integrates conventional plated through-hole, and microvia interconnect processing for intermediate component density designs to give you the best Standard Rigid-Flex solutions. Multek incorporates stiffeners, air gap construction, shielding, and coverlays from our FPC systems as needed.
With prequalified materials from our matrix of low-cost, Asia-sourced rigid and FPC laminates, coverlays, stiffeners, and shielding, Multek provides end-to-end solutions optimized for cost-sensitive applications. Multek offers engineering support during the design and specification phase, to create an optimal bill of materials and stack-up to deliver low cost, high processing, and assembly yields, and the best reliability.