Multek provides industry-leading HDI capabilities to optimize today's challenging designs. The use of HDI and Every Layer Interconnect (ELIC) stacked copper filled µVias, fine feature etching, and precision registration provide unique, mass-production solutions for complex designs.
With extensive investments in leading-edge production systems, rigid HDI PCB Multek can build the next generation of interconnect solutions.
Rigid-Flex designs utilizing HDI/ELIC capabilities eliminate the need for the module connectors and saves precious space within the slim, high-style designs compact designs. Multek provides this new end-to-end solution from initial design to mass production. Our Global Engineering, ITC, and Business teams are ready to help you quickly transform ideas into new interconnect platforms that achieve mass-production scale.