In response to new system performance demands in the wireless infrastructure market, Multek introduced our first inlay Printed Circuit Board (PCB) technology in 2012. In prior product applications, a full panel FR4 material is applied in hybrid stack-up construction with an entire panel core of expensive high frequency yet low loss material, resulting in an expensive finished product.
To reduce total panel cost, Multek introduced selective semi-finished inlay circuitry using high-frequency laminate, into the overall FR4 laminate panels using 3D structuring. With only a small part of the final PCB design area specified for high-frequency signal transfer, our inlay innovations reduce the amount of high-frequency laminate and allow integration of our thermal solutions into your final optimized design. A full design guide is available upon request.