With the revolution in portable communications products over the last decade, Rigid Flexible Circuits have become a preferred design solution for complex, three-dimensional product assembly, and advanced component surface mounting demands.
If you are seek advanced integration of high volume HDI rigid board technologies with advanced flex circuit layering, Multek is your answer. Through Multek’s engineering of an optimized set of materials and fabrication processes, you will receive exceptional mass production capability and capacity. Whether you require a solution for a mobile phone, wearable device, or high speed telecommunications network, Multek is ready with a fully-qualified matrix of laminates and process chemistries to deliver to your demand and schedules.
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