Skip to main content
Home

Delivering Powerful Interconnect Solutions that Enable Our Customer's Success

shr

  • facebook
  • Linkedin
  • Wechat
  • twitter
  • mail

Main navigation

  • Home
  • About
    • Mission & Values
    • Executive Leadership
    • Locations
    • CSER
    • History
  • Markets
    • Telecommunications
    • Computing
    • Mobile
    • Wearables
    • Consumer Electronics
    • Industrial / Commercial / Instrumentation
    • Energy
    • Medical
    • Automotive
  • Technology
    • Multilayer Rigid PCB
    • High-Density Interconnect
      • Microvia
      • Every Layer InterConnect
    • Flexible Circuits
      • Single & Double sided circuits
      • Multi-Layer Flexible
    • Rigid-Flex Circuits
      • Standard Rigid-Flex
      • HDI Rigid-Flex
      • Semi Flex
    • Thermal Management
      • Thru-Hole Via Farm
      • COIN
    • Inlay
    • Assembly
    • Reliability
    • Advanced Materials
  • Customer Engagement
    • Design, Innovation & IP
    • Rapid Prototyping & QTA
    • New Product Intro & DFM
    • Zero Defect
    • Supply Chain Management
    • Manufacturing & Assembly
    • Global Reach & Delivery
    • Worldwide Network
  • News
    • Press
    • Events
  • Careers
  • Support
  • Contact Us
    • Sales
    • Have Us Contact You
  1. Technology
  2. Thermal Management
  3. COIN
Technology - Thermal - Coin

COIN

  • Thru-Hole Via Farm
  • COIN
x

For enhanced heat dissipation in power amplifier boards, network products customers are designing with “COINS” technologies into high ASP 10-16 layer count PCBs. Three different copper COINS technologies have been setup in Multek China: 
 

coin

coin2

Stephen Sims
Stephen Sims
Americans Director
Kenth Svärd
Kenth Svärd
EMEA Director
Stan Chow
Stanley Chow
Asia Director
  • Facebook
  • Linkdein
  • Youtube
  • Wechat
  • Mail

Footer menu

  • About
    • Mission & Values
    • Executive Leadership
    • Locations
    • CSER
    • History
  • Markets
    • Telecommunications
    • Computing
    • Mobile
    • Wearables
    • Consumer Electronics
    • Industrial / Commercial / Instrumentation
    • Energy
    • Medical
    • Automotive
  • Technology
    • Multilayer Rigid PCB
    • HDI
    • Flexible Circuits
    • Rigid flexible circuits
    • Thermal management
    • Assembly
    • Reliability
    • Advanced Materials
  • Customer Engagement
    • Design, Innovation & IP
    • Rapid Prototyping & QTA
    • New Product Intro & DFM
    • Zero Defect
    • Supply Chain Management
    • Manufacturing & Assembly
    • Global Reach & Delivery
    • Worldwide Network
  • News
    • Press
    • Events
  • Careers
  • Support
  • Contact Us
    • PCB Sales
    • Flexible Circuit Sales
    • Have Us Contact You
    • Privacy Policy

© Copyright 2019 Multek Corporation. All rights reserved. Email: sales@multek.com