You now have a cost effective alternative to flat cable and expensive connector integration approaches: multi-layer flexible printed circuits where each layer is produced using adhesive and adhesiveless type polyimide (PI) film substrates with copper trace thicknesses ranging from 18um to 140um. Your design can be rendered into multilayer stackups that include single and multiple air gaps for conformal installations, conventional plated through hole (PTH) plating, plus coverlay and solder mask circuit protection.
You can choose final-tested circuits in single pieces or multiple up arrays, with moderate levels of lead-free reflowed SMT. These include component solder attachments on single or double-sided circuit sections with adhesively-attached stiffeners.
- Multilayer circuitry-from 3 to 14+ layers
- Adhesive-based and adhesiveless constructions, including thermoplastic and thermoset stiffener attachment. Stiffeners include glass reinforced PI, Epoxy, and punched or formed metal parts
- PET, PEN or PI film substrates
- Low-cost, conventional fabrication and lamination completed with PTH based plating
- Photo imaging with minimum conductor pitch at 0.25mm
- Screened inks, photo-imageable soldermasks, or laminated coverfilm dielectrics
- Connectors may be mounted by SMT reflow, Pin in Hole soldering, and Conductive adhesive attachment
- Surface finishes include anti-tarnish. immersion silver, tin, solder, electroplated nickel/gold and ENIG
- Various support materials can be selectively added including:
- Metal heatsinks
- Film stiffeners
- FR4/CEM1/G10 rigidizers
- Molded plastic assemblies
- EMI shielding