To stay ahead of the latest trends, like increasing miniaturization and wearable technologies, you expect a Printed Circuit Board (PCB) partner with innovative engineering. You need industry-leading capabilities that can, for example, integrate Every Layer Interconnect (ELIC) stacked and copper-filled microvia interconnection process, on HDI rigid PCBs, with fine-line FPC technology to create unique, mass production-ready offerings like Multek’s ”ELIC-Rigid-Flex”.
With extensive investments in leading-edge production systems -- for both rigid PCB-based ELIC and our latest roll-to-roll FPC circuitry -- we are able to build the next generation of interconnect solutions for you. This includes dense, miniaturized circuits assembly for 4G mobile phones, advanced wearables, and medical electronics.
ELIC-Rigid-Flex eliminates the need for the module connectors and saves precious space and volume within the slim, high-style designs that consumers demand. Multek provides this new end-to-end solution from initial design sketch to mass production. Our Global Engineering, ITC, and Business Excellence Engineering teams are ready to help you transform ideas into new interconnect platforms that achieve mass production scale quickly.