Standard Rigid-Flex provides a cost effective alternative to rigid Printed Circuit Board (PCB) modules and Flexible Printed Circuit (FPC) interposers/connector systems used for low to mid-range consumer electronics products. Multek integrates conventional plated through-hole and microvia interconnect processing for intermediate component density designs to give you the best Standard Rigid-Flex solutions. Moreover, stiffeners, air gap construction, shielding, and coverlays from our low-cost FPC systems are routinely applied as per your needs.
With prequalified materials from our matrix of low-cost, Asia-sourced rigid and FPC laminates and coverlays, you can expect end-to-end solutions optimized for cost-sensitive applications. Beginning with value engineering during the design and specification phase, Multek’s engineers work with you to create an optimal bill of materials and stack-up to deliver low cost, high processing and assembly yields, and the best field reliability.