Multek presented at IPC APEX Expo 2018 on the the following topics:
- “Printed Circuit Board Factory 4.0” by Dana Korf, Senior Director Manufacturing Engineering, on February 26th, 8:20am
- “Thermo-Mechanical Characterization of Next Generation Substrate Like Printed Circuit Boards (SLP) Materials” by Michael Glickman, Director Research and Development, on February 28th, 10:30am to 12:00pm
- "SLP+" by Devanshu Kant, Research and Development Engineer, on February 28th, 10:30am to 12:00pm
- “Minimizing Signal Degradation in Flexible PCB Microstrip and Stripline Transmission Lines That Use Cross-Hatched Return Planes” by Vijay Moghe, Signal Integrity Test Engineer, on March 1st, 9am to 10am.
CA, United States