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Multek presented at IPC APEX Expo 2018 on the the following topics:

  • “Printed Circuit Board Factory 4.0”  by Dana Korf, Senior Director Manufacturing Engineering, on February 26th, 8:20am
  • “Thermo-Mechanical Characterization of Next Generation Substrate Like Printed Circuit Boards (SLP) Materials” by Michael Glickman, Director Research and Development, on February 28th, 10:30am to 12:00pm
  • "SLP+" by Devanshu Kant, Research and Development Engineer, on February 28th, 10:30am to 12:00pm
  • “Minimizing Signal Degradation in Flexible PCB Microstrip and Stripline Transmission Lines That Use Cross-Hatched Return Planes” by Vijay Moghe, Signal Integrity Test Engineer, on March 1st, 9am to 10am.
Address

CA, United States