IPC APEX Expo 2018

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Come see Multek present at IPC APEX Expo 2018. We will be presenting the following;

  • Dana Korf, Senior Director Manufacturing Engineering, will be presenting on “Printed Circuit Board Factory 4.0” on Monday, February 26th, 8:20am
  • Michael Glickman, Director Research and Development, will be presenting on “Thermo-Mechanical Characterization of Next Generation Substrate Like Printed Circuit Boards (SLP) Materials” on Wednesday, February 28th, 10:30am to 12:00pm
  • Devanshu Kant, Research and Development Engineer, will be presenting on SLP+ on Wednesday, February 28th, 10:30am to 12:00pm
  • Vijay Moghe, Signal Integrity Test Engineer, will be presenting on “Minimizing Signal Degradation in Flexible PCB Microstrip and Stripline Transmission Lines That Use Cross-Hatched Return Planes” on Thursday, March 1st, 9am to 10am.
Address

CA,

United States