Come see Multek present at IPC APEX Expo 2018. We will be presenting the following;
- Dana Korf, Senior Director Manufacturing Engineering, will be presenting on “Printed Circuit Board Factory 4.0” on Monday, February 26th, 8:20am
- Michael Glickman, Director Research and Development, will be presenting on “Thermo-Mechanical Characterization of Next Generation Substrate Like Printed Circuit Boards (SLP) Materials” on Wednesday, February 28th, 10:30am to 12:00pm
- Devanshu Kant, Research and Development Engineer, will be presenting on SLP+ on Wednesday, February 28th, 10:30am to 12:00pm
- Vijay Moghe, Signal Integrity Test Engineer, will be presenting on “Minimizing Signal Degradation in Flexible PCB Microstrip and Stripline Transmission Lines That Use Cross-Hatched Return Planes” on Thursday, March 1st, 9am to 10am.